Cowen restated their market perform rating on shares of ASE Technology (NYSE:ASX) in a research note released on Tuesday, Briefing.com Automated Import reports. They currently have a $30.00 price target on the semiconductor company’s stock, down from their prior price target of $31.00.
Several other analysts also recently weighed in on ASX. CLSA raised ASE Technology to a buy rating in a report on Tuesday, April 2nd. Zacks Investment Research downgraded ASE Technology from a buy rating to a hold rating in a report on Tuesday, April 2nd. Macquarie raised ASE Technology from an underperform rating to a neutral rating in a report on Thursday, May 2nd. Finally, ValuEngine raised ASE Technology from a sell rating to a hold rating in a report on Monday, February 4th. Five equities research analysts have rated the stock with a hold rating and one has issued a buy rating to the company. The company has an average rating of Hold and an average price target of $17.38.
NYSE ASX traded down $0.19 during trading on Tuesday, reaching $4.11. 1,235 shares of the company’s stock were exchanged, compared to its average volume of 764,882. The company has a market capitalization of $8.93 billion, a price-to-earnings ratio of 10.54, a price-to-earnings-growth ratio of 5.05 and a beta of 0.90. The company has a debt-to-equity ratio of 0.57, a current ratio of 1.23 and a quick ratio of 0.94. ASE Technology has a 1 year low of $3.46 and a 1 year high of $5.28.
About ASE Technology
ASE Technology Holding Co, Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions.
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