ACM Research (NASDAQ: ACMR) and Applied Materials (NASDAQ:AMAT) are both computer and technology companies, but which is the superior investment? We will compare the two companies based on the strength of their dividends, profitability, analyst recommendations, institutional ownership, earnings, risk and valuation.
This is a breakdown of recent ratings and recommmendations for ACM Research and Applied Materials, as provided by MarketBeat.
|Sell Ratings||Hold Ratings||Buy Ratings||Strong Buy Ratings||Rating Score|
This table compares ACM Research and Applied Materials’ net margins, return on equity and return on assets.
|Net Margins||Return on Equity||Return on Assets|
Insider & Institutional Ownership
6.8% of ACM Research shares are owned by institutional investors. Comparatively, 79.3% of Applied Materials shares are owned by institutional investors. 0.4% of Applied Materials shares are owned by company insiders. Strong institutional ownership is an indication that hedge funds, large money managers and endowments believe a stock is poised for long-term growth.
Earnings and Valuation
This table compares ACM Research and Applied Materials’ revenue, earnings per share and valuation.
|Gross Revenue||Price/Sales Ratio||Net Income||Earnings Per Share||Price/Earnings Ratio|
|ACM Research||$36.51 million||5.05||-$320,000.00||N/A||N/A|
|Applied Materials||$14.54 billion||4.31||$3.43 billion||$2.65||22.52|
Applied Materials has higher revenue and earnings than ACM Research.
Applied Materials pays an annual dividend of $0.40 per share and has a dividend yield of 0.7%. ACM Research does not pay a dividend. Applied Materials pays out 15.1% of its earnings in the form of a dividend.
Applied Materials beats ACM Research on 12 of the 14 factors compared between the two stocks.
About ACM Research
Acm Research, Inc. develops, manufactures and sells single-wafer wet cleaning equipment, which semiconductor manufacturers uses in manufacturing steps to remove particles, contaminants and other random defects in fabricating integrated circuits, or chips. The Company’s Ultra C equipment is designed to remove random defects from a wafer surface, even at an advanced process node (the minimum line width on a chip) of 22 nanometers (nm) or less. Its equipment is based on its Space Alternated Phase Shift (SAPS) and Timely Energized Bubble Oscillation (TEBO) technologies. Its SAPS technology uses alternating phases of megasonic waves to deliver megasonic energy to flat and patterned wafer surfaces in a uniform manner on a microscopic level. Its TEBO technology provides cleaning for both conventional two-dimensional (2D) and three-dimensional (3D) patterned wafers at advanced process nodes.
About Applied Materials
Applied Materials, Inc. provides manufacturing equipment, services and software to the global semiconductor, display and related industries. The Company’s segments are Semiconductor Systems, which includes semiconductor capital equipment for etch, rapid thermal processing, deposition, chemical mechanical planarization, metrology and inspection, wafer packaging, and ion implantation; Applied Global Services, which provides integrated solutions to optimize equipment and fab performance and productivity; Display and Adjacent Markets, which includes products for manufacturing liquid crystal displays, organic light-emitting diodes, upgrades and roll-to-roll Web coating systems and other display technologies for televisions, personal computers, smart phones and other consumer-oriented devices, and Corporate and Other segment, which includes revenues from products, as well as costs of products sold for fabricating solar photovoltaic cells and modules, and certain operating expenses.
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